With the development of electronic system to the direction of integration and intelligence, the system structure is more and more complex, and the volume is more and more huge. In recent years, stereo assembly technology has attracted more and more attention because it can greatly improve the assembly density of the system and reduce the size of the system, especially in the field of aerospace.
       The vertical interconnection scheme of three-dimensional assembly circuit composed of three-layer circuit board adopts the bonding technology of transfer board, copper thick wire bonding technology and the vertical interconnection technology of fuzz buttons to realize the mechanical fixation and vertical electrical interconnection between three-layer circuit boards.

       Floss Pin®（i.e. Fuzz Button or CIN::APSE） is a patent product of Luoyang Fuzz button Interconnect Technology Co.,Ltd.  It is the most reliable and advanced welding compression-style interconnect technology。It provides the board-to-board advantages for high-speed telecom，stringent military and aerospace，and demanding automotive applications。

      It is the ideal interconnect solution for vertical interconnection of the microwave module，Ideally suited for applications in which high reliability，high-speed signals，tight envelope dimensions，high density，and extreme environmental conditions need to be met。

      We are the first company successfully developed and mass production the Fuzz Button® or CIN::APSE® in the China。The product performance is leading inChina, and the key parameters have reached the level of similar products such as fuzz buttons®  from Custom Interconnects in theUSA.