The adoption of active electronically scanned array (AESA) technology is the inevitable trend of the development of the next generation radar, which has become the consensus in the international radar field. The radar using this technology contains a large number of TR components, and the performance, size and weight of TR components become important factors affecting the performance of the whole AESA system. Driven by the rapid development of semiconductor, new materials, three-dimensional integration and packaging technology, the T / R module of active electrical scanning array radar has experienced a transition from brick to tile.
       LTCC (low temperature co fired ceramics) technology provides a solution for the high-density integrated packaging of tile T / R module.
       The tile T / R module with LTCC stereo package shows superior performance. With the development of miniaturization of components, interconnection technology matching with high integration components becomes more and more important. MMIC chip and RF circuit are located in the cavity of the module, protected by airtight package, and the radiation unit is located outside the module cover plate, so there is a need for internal and external RF interconnection. The interconnection of RF in plane has been realized by microstrip line, stripline and coplanar waveguide, while the interconnection in vertical direction is the main research content in multi-layer stereo structure. When using LTCC as the dielectric substrate and packaging, the vertical interconnection of fuzz button elastic connector can provide tight connection and can be reused because no solder is used. fuzz button has been proved to be able to provide superior RF connection and DC connection, and can be used in tile T / R module with three-dimensional structure.

       Floss Pin®（i.e. Fuzz Button or CIN::APSE） is a patent product of Luoyang Fuzz button Interconnect Technology Co.,Ltd.  It is the most reliable and advanced welding compression-style interconnect technology。It provides the board-to-board advantages for high-speed telecom，stringent military and aerospace，and demanding automotive applications。

      It is the ideal interconnect solution for vertical interconnection of the microwave module，Ideally suited for applications in which high reliability，high-speed signals，tight envelope dimensions，high density，and extreme environmental conditions need to be met。

      We are the first company successfully developed and mass production the Fuzz Button® or CIN::APSE® in the China。The product performance is leading inChina, and the key parameters have reached the level of similar products such as fuzz buttons®  from Custom Interconnects in theUSA.