MCM (multichip module) technology is an effective way to reduce the volume and weight of the system and improve the performance of the system. Its application has spread from military, aerospace and large-scale computers to electronic system products such as automobiles, communications, industrial devices, instruments and medical equipment. At present, LTCC (low temperature co fired ceramic) has the most development advantages in the multi chip component technology. Because of its low loss, high integration and low cost in microwave and millimeter wave band applications, it has developed rapidly in recent years. With the increasing demand of miniaturization and integration of microwave and millimeter wave system, the passive circuit structure, system package design and other technologies of LTCC become the key to play its advantages.
       Vertical interconnection between microwave and millimeter wave modules of LTCC: in order to achieve high-density interconnection, this paper adopts the form of surface interconnection, and uses the fuzz button elastic connector to connect. In microwave frequency band, the interconnection characteristics of three wool buttons are improved by capacitance and inductance compensation. For millimeter wave module interconnection, a novel vertical interconnection structure is proposed. Based on the advantages of LTCC substrate, SIW is fabricated on LTCC substrate, and the transition structure from SIW to coaxial is formed with the button connector to realize the new interconnection structure, and the Y branch SIW structure is used to realize the broadband interconnection.

       Floss Pin®（i.e. Fuzz Button or CIN::APSE） is a patent product of Luoyang Fuzz button Interconnect Technology Co.,Ltd.  It is the most reliable and advanced welding compression-style interconnect technology。It provides the board-to-board advantages for high-speed telecom，stringent military and aerospace，and demanding automotive applications。

      It is the ideal interconnect solution for vertical interconnection of the microwave module，Ideally suited for applications in which high reliability，high-speed signals，tight envelope dimensions，high density，and extreme environmental conditions need to be met。

      We are the first company successfully developed and mass production the Fuzz Button® or CIN::APSE® in the China。The product performance is leading inChina, and the key parameters have reached the level of similar products such as fuzz buttons®  from Custom Interconnects in theUSA.