With the development trend of miniaturization and high concentration of electronic products, the packaging technology of electronic products is gradually stepping into the era of microelectronics packaging.
       Two dimensional assembly is developing to three dimensional (3D) packaging. Chip level three-dimensional packaging is usually called three-dimensional packaging or three-dimensional microelectronic packaging with high performance.
       In general, three-dimensional packaging is to stack two or more chips (or chip packages) in a single package. It is a multi chip stack that emphasizes the positive direction of the chip. In fact, it is also a stack package. Stereo assembly technology is the best way to improve the assembly density, which can reach 200% - 300%. There are three basic types of 3D package: stacked chip package, embedded 3D package and active substrate 3D package.
       From the perspective of assembly, the most direct and convenient three-dimensional assembly technology between subsystems (function blocks) is vertical interconnection technology. There are many ways of vertical interconnection, mainly including bottom vertical interconnection and peripheral vertical interconnection. The interconnection methods include convex point (ball), micro reed, hole filling method and fuzz button, etc

       Floss Pin®（i.e. Fuzz Button or CIN::APSE） is a patent product of Luoyang Fuzz button Interconnect Technology Co.,Ltd.  It is the most reliable and advanced welding compression-style interconnect technology。It provides the board-to-board advantages for high-speed telecom，stringent military and aerospace，and demanding automotive applications。

      It is the ideal interconnect solution for vertical interconnection of the microwave module，Ideally suited for applications in which high reliability，high-speed signals，tight envelope dimensions，high density，and extreme environmental conditions need to be met。

      We are the first company successfully developed and mass production the Fuzz Button® or CIN::APSE® in the China。The product performance is leading inChina, and the key parameters have reached the level of similar products such as fuzy buttons®  from Custom Interconnects in theUSA.