50 Ohms, PCB-Surface Compression Mount，Field Replaceable, 2 Hole Flange, Microwave  Solderless PCB Connectors with Fuzz button

Replace the Amphenol/SV Microwave LiteTouch Solderless PCB Connectors

    Microwave Solderless PCB Connectors with Fuzz button offer a complete line of high frequency coaxial / surfacemountPCBconnectors that meet the industry need for high performing, highly reliable solderless connectors for precision thin substrate mounting. As frequencies increase and board substrates become thinner, the standard solderless PCB compression mount connectors can create undesirable results on thin (< .010") dielectric PCB substrates. Microwave Solderless PCB Connectors with Fuzz button addresses this issue by maintaining a solderless connection while keeping the board material intact. Current configurations include 2.92mm, 2.4mm, and SMA versions.

Features

Solderless PCB compression mount for fast and easy installation (available with screws)

Conforms to flexible circuit boards

Non-destructive engagement on soft or thin (<.010”) dielectric cores

Series: SMA, 2.92mm, 2.4mm, and 1.85mm

Cost effective testing solutions

Applications

Internet of Things (IoT)

5G Wireless Infrastructure

SmartCitiesand agriculture

Embedded computing

Precision thin substrate mounting

Ideal for high speed PCB materials

RF test and measurement

Stripline, microstrip and coplanar waveguide PCB launch

As frequencies increase and board substrates become thinner, the standard solderless PCB compression mount connectors in Figure 1, below, can create undesirable results on thin (< .010”) dielectric PCB.  The Microwave Solderless PCB Connectors with Fuzz button, shown in Figure 2, addresses this issue by maintaining a solderless connection while keeping the board material intact.

Figure 1: Unmated and mated standard solderless compression on thin (<.010”) dielectric PCB

Figure 2: Unmated and mated LiteTouch solderless compression on thin (<.010”) dielectric PCB

Figure 3 shows the full path performance of connector to connector on the same 1” trace of a 10mil thickRogers

RO3003 CPW stackup. The performance variation is driven by the launch trace deformation into the board creating an

unforeseen capacitive area. The LiteTouch maintains the structure of the board and leads to stable RF performance.