8 Board Stack Connectors 板叠层连接器

超薄外形(Low Profile)板对板连接器。该产品可在PCB板中实现低平且紧凑的内部互连。其安装高度为0.81mm，触点间距1.0mm。此外，该连接器还具备高速传输性能(信号速率超过20GHz)，触点阻抗小于25mΩ。 

采用Floss Pin®毛纽扣接触技术(一种免焊线绕接触技术)，经现场应用验证具有可靠性，可用于从高端计算机服务器到军事喷气航空器的多种领域。 

其触点数量从不到10个到超过2,000个不等，并可定制不同形式的排列或特殊触点。 

这款连接器具有独特的机械和电气性能，适用于计算机、通信及医疗电子设备中的RF板对板连接。 

Designed for applications requiring low profile, compact footprint interconnects between printed circuit boards or components, the Connectors offer a low mated height of 0.81mm in custom, flexible footprint configurations with contact spacing as close as 1.0mm. In addition, the connectors provide excellent high speed performance, easily supporting signal speeds in excess of 20 Ghz with contact resistance less than 25 mΩ. 

The Low Profile Connectors utilize proven Floss Pin® contact technology, a unique solderless wound-wire contact with field-proven reliability in demanding applications ranging from high end computer servers to military jet aircraft. 

Available in contact counts ranging from less than 10 contacts to over 2,000, the Connectors can be custom configured in patterns of arrays or individual contacts depending on the unique demands of an application. 

The unique combination of mechanical and electrical features makes the Low Profile Connectors an ideal choice for RF Board-to-Board assemblies, Low-Profile Mezzanine Boards, and High-Performance Component-to-Board assemblies in Computer, Communications and Medical Electronics market applications.