System on Package Design Based on Vertical Interconnection of Fuzz-button
System on Package Design Based on Vertical Interconnection of Fuzz-button
Small vertical interconnect technology is one of the most important technologies in system board-level integration. Developed a solder-less vertical interconnect structure-fuzzy button, the high- frequency signal transmission between the package and the circuit board is achieved. The size and electrical properties of fuzzy buttons are designed using three-dimensional electromagnetic simulation and optimization, and the corresponding processes are also researched. Good results of the integrated approach are verified by testing, it has the advantages of small size, easy assembly and maintenance, being considered has wide applications in system 3D integration and miniaturization design of RF/microwave circuit.
Floss Pin®（i.e. Fuzz
Button or CIN::APSE） is a patent
product of Luoyang
Fuzz button Interconnect Technology Co.,Ltd.
It is the most reliable and advanced welding
compression-style interconnect technology。It provides the board-to-board advantages for high-speed
telecom，stringent
military and aerospace，and demanding
automotive applications。
It is the ideal interconnect solution for vertical interconnection
of the microwave module，Ideally
suited for applications in which high reliability，high-speed signals，tight envelope dimensions，high density，and extreme
environmental conditions need to be met。
We are the first company successfully developed and mass production the Fuzz
Button® or CIN::APSE® in the China。The product performance is leading inChina, and the key parameters have reached the
level of similar products such as fuzz buttons®
from Custom
Interconnects in theUSA.
The electrical connections that are formed may include, zero-insertion-force connections, board-to-board connections, and coaxial cable connections.
